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Metòd Teknoloji Pwosesis yo souvan itilize pou vis boul

Jul 19, 2021

Akòz senaryo aplikasyon diferan, metòd yo pwosesis nan vis boul yo tou diferan. Nan sans de sitiyasyon aktyèl la nan pwosesis boul vis, metòd yo teknoloji pwosesis nan vis boul yo sitou divize an de kalite: chip pwosesis ak chip -gratis pwosesis. Metòd pwosesis de vis boul sa yo analize anba a.

1. Tretman ak ti kal pen.

Boul vis chip pwosesis se itilize nan koupe fòme metòd nan pwosesis vis la, sitou ki gen ladan vire ak toubiyon fraisage.

Vire refere a itilizasyon diferan zouti vire oswa lòt zouti sou yon tour pou trete plizyè sifas rotary, tankou: sifas enteryè ak ekstèn silendrik, sifas enteryè ak ekstèn conique, fil, genyen siyon, elatriye, vire anjeneral yo itilize nan pwosesis sèl. -pati aks, tankou: Arbr dwat ak disk, ansanm pati.

 Eddy current cutting is an efficient thread processing method, suitable for large batches of rough thread processing. Its process is to use carbide cutters to mill threads, which has the advantages of fast cooling and high production efficiency. Threads that do not require high precision can be used to complete cutting.

2. Pa gen tretman chip.

Boul vis chipless pwosesis refere a itilize nan metal plastik fòme metòd nan pwosesis vis la, sitou frèt extrusion ak woule frèt.

Metòd ekstrizyon frèt la se yon metòd pwosesis kote vid metal la mete nan kavite frèt extrusion mouri a, ak nan tanperati chanm, vid metal la sibi presyon atravè yon kout pyen fiks sou laprès la plastik defòme vid metal la fè yon. pati.

Tandem dra frèt-woule yo trete pa dra cho-woule nan tanperati chanm. Malgre ke fèy asye yo chofe pandan pwosesis la, yo toujou rele yo frèt -woule. Pwosesis la frèt woule fòme nan kous la vis boul refere a fòs la friksyon ki te fòme ant roulo a ak ba wonn metal la anba pouse nan presyon espiral, ki mòde ba an metal nan zòn nan woule, ak Lè sa a, se fòse yo woule pa roulo a. pou pwodwi plastik deformation.

 Compared with traditional cutting processing, chipless processing has higher production efficiency; processing accuracy can be increased by 1 to 2 times; material consumption is less; when metal fibers are torn and the surface quality is not high, the chip processing requires more grinding Process, chip-free processing performance is higher.

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